#IPC 610 MANUAL ESPAГ‘OL PLUS#

It is crucial to consider during the design phase what implications the design and layout will have on the ability to produce the desired Class of product. While the IPC-A-610 manual may not be the most thrilling read, familiarizing yourself with the specs laid out in it will help to ensure that you are communicating clearly what your productвЂ™s requirements are to your contract manufacturer, preventing any room for interpretation. Image Credit: Todd Henninger, Field Applications Engineer Mid-West Region, Viasystems. Because Class 3 allows not breakouts, annular rings must be oversized to accommodate tolerances with respect to drill sizes, drill registration, plating requirements, etc. Class 2 allows for breakout from the annular ring, while Class 3 does not allow breakout. The drill breakout requirement affects via size and the size of the annular ring. While there is no exact spec for PTH oversize to achieve Class 3, the smaller the gap surrounding the lead, the more difficult it will be to obtain the 75% fill.Дrill Breakout Requirement for Fabrication Class Specs:Д¬ertain specs for Class 2 and Class3 are applicable at the design and fabrication levels of the PCB. If the board is not designed to accommodate this, then Class 3 cannot be achieved during production. The smaller the PTH, the more difficult it is to get the paste into the barrel. When designing the plated-through-hole (PTH), ACDi sets the goal of 15 mils over the diameter of the lead, as this leaves 7.5 mils on either side, allowing for paste to fill deeper into the barrel. Depending on the design of the boards, this may or may not be achievable. Class 2 requires a 50% barrel fill, while Class 3 requires a 75% barrel fill. Image Credit: Kenny Houck, SMT Engineer, ACDiД¬lass 2 and Class 3 requirements differ on the amount of barrel fill required for through-hole leads. The footprint has too large of an air gap, not allowing for an adequate heel fillet per IPC Class 3. The solder cannot вЂњwick upвЂќ the heel of the lead if the heel is not above the pad.Д®x: The back of the lead hangs off of the pad. Class 3 cannot be achieved if the air gap between pads is too wide. In order to achieve this, the pads must be appropriately sized (proper footprint) for the solder to have enough room to вЂњwick upвЂќ the hole of the lead.

#IPC 610 MANUAL ESPAГ‘OL PLUS#

For minimum Class 2 acceptance, вЂњminimum heel fillet height is equal to solder thickness plus 50% thickness of lead at joint side.вЂќ For Class 3 acceptance, вЂњminimum heel fillet height is equal to solder thickness plus thickness of lead at joint side.вЂќ The IPC guidelines state that in order for the solder of heel fillets to meet specs, there are minimum and maximum height requirements. Here are some common examples found in the assembly process that must be inspected to Class 2 or Class 3 based on the customerвЂ™s listed specifications. The IPC specifications pertaining to Electronic Assemblies are found within the 420 page manual that can be purchased through the IPC website. Class 3, вЂњThe major differences between Class 2 & Class 3 are found in component placement for surface-mount components, cleanliness requirements based on residual contaminants on the assemblies, and plating thicknesses as defined in plating through hole and on the surface of PCBs.вЂќ Greater attention to heel fillets, precise component placement, and the absence of contaminants, increases the thoroughness of inspection required, and in turn the amount of labor directed at the production and inspection of this product. As Circuitnet describes in their вЂњAsk the ExpertsвЂќ, Class 2 vs. One of the greatest factors driving increased costs when an assembly moves from Class 2 and Class 3 is inspection.

Was the PCB designed to adhere to these requirements?.Is the reliability of the product vital to the maintenance of life?.It is first necessary to determine the following: Class 3 Part 1, there are many factors that determine whether a product falls under the IPC-610 Class 2 or 3.

Ipc 610 manual espaГ±ol